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Shenzhen Xin Nan Tian Technology Co., Ltd.

Address: Building 5, Zhengzhong Industrial Park, Dayangtian, Fuyong Town, Bao'an District, Shenzhen, China

Tel: 0755-29851556  

Fax: 0755-29851539

E-mail:linxinxiang@126.com

Website: www.zsrxtravel.com



昆山micro Sim connector

  • category:昆山microSim Series

  • The number of clicks:
  • Release date:2018/06/22
  • Inquiry
details
Product ID:
XNT-SIM-111115
product name:
6Pin 1.30mm height No-push micro Sim connector
specification:
Plastic: black high temperature UL94V-0; terminal: copper alloy; shell: stainless steel
Product Note:
Without CD terminal, L15.10*W13.00*H1.30
Product Category:
SIM microSim NanoSIM


Technical parameters: 
1. Rated current: 0.5A AC / DC  
2. Operating temperature: -30 °C ~ +85 °C 
3. Storage temperature: -30 °C ~ +85 °C 
4. Contact resistance: 30m ohms max. 
5. Withstand voltage : 500V AC / 1 minute 
6. Insulation resistance: 500M ohms min./500VDC 
7. Durability: microSIM 3000 times 
8. Product temperature resistance: 250±5°C 10S 
9. Flatness: 0.10mm MAX. 
10. RoHS compliant 
11 Stable and superior performance 
Product Description: 
1. This connector is widely used in mobile phones, tablet computers, navigators, LCD TVs, automobiles, aviation, smart wearable devices, etc.; 
2. This product inspection process is: IQC feed inspection - > Storage -> Pre-line self-test -> IPQC inspection -> FQC final inspection -> OQC cargo inspection 
3. This product production process is: pre-line inspection -> Binder ribbon -> assembly microSIM Shell-->card test-->electrical test-->flatness test-->positive test-->appearance test-->FQC test-->storage



XNT-SIM-111115.pdf


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